lantiq.com: Latest News http://www.lantiq.com/ Latest news from Lantiq de lantiq.com: Latest News http://www.lantiq.com/typo3conf/ext/tt_news/ext_icon.gif http://www.lantiq.com/ 18 16 Latest news from Lantiq TYPO3 - get.content.right http://blogs.law.harvard.edu/tech/rss Tue, 21 May 2013 09:57:00 +0200 ETSI publishes first specification for Ultra Low Energy DECT http://www.lantiq.com/media-center/news/press/278-ule-lantiq-etsi/ ETSI publishes first specification for Ultra Low Energy DECT - and expects to lead the field in the M2M market ETSI publishes first specification for Ultra Low Energy DECT - and expects to lead the field in the M2M market ETSI has published the first Technical Specification (TS 102-939-1) on DECT ULE (Ultra Low Energy), a low power consumption radiotechnology intended for home automation and other Machine-to-machine (M2M) applications. Full Release is available here. Lantiq is a member of the DECT ULE Alliance ]]> Industry News & Articles Tue, 21 May 2013 09:57:00 +0200 New Lantiq Chip Provides up to150 Mbps Vectoring & 200 Mbps Bonding http://www.lantiq.com/media-center/news/press/lantiq-vectoring-200mbps/ Article in the current issue of the Online Reporter New Lantiq Chip Provides up to150 Mbps Vectoring & 200 Mbps Bonding
   - AnyWAN Offers Box Makers Any WAN
   - The Coming Integration of LTE and DSL
Lantiq  this  week  announced  that  its  new VRX300 family of vectoring chipsets for use in gateways will support  download  speeds  of  up  to  150  mbps  and,
when  used  over  bonded  pairs  of  telephone  wires, will  provide  download  speeds  up  to  200  Mbps.
Read the Full article here.  ]]> Industry News & Articles Tue, 21 May 2013 09:50:00 +0200 New Lantiq VDSL Chipset Sets CPE Performance Benchmarks http://www.lantiq.com/media-center/news/press/275-lantiq-vectoring-broadband-bonding-bonded-vdsl/ Ultra-Fast Access Network Speeds with 200 Mbps Bonding and up to 150 Mbps Vectoring Paired with Industry-Leading Integration and Flexibility for In-home Networking Munich/Neubiberg, Germany – May 14th, 2013 – Lantiq, a leading supplier of broadband access and home networking technologies, today introduced the industry’s most integrated and highest performance VDSL chipset family, the XWAY™ VRX300. Gateway designs based on the new chipset can reach data rates of 200 Mbits (two pair bonded) and up to 150 Mbits (vectoring) while supporting an array of home networking features, including integrated Wireless LAN (Wi-Fi), Gigabit Ethernet and VoIP. The new VDSL chipset provides broadband equipment vendors with the flexibility to produce routers and gateways that support advanced carrier services with fewer components than any other available chipset. All ITU-T standard frequency band plans (Profile 8, 12, 17 and 30MHz) are supported from a single hardware CPE design, and systems can be engineered for the widest possible range of customer premises network functionality. XWAY™ VRX300 Highlights and Benefits
  • The chipset embodies the Lantiq AnyWAN™ system architecture, which pairs the company’s advanced XWAY™ GRX300 Communication Processor with the XWAY™ VRX318 VDSL Transceiver chip.
  • This ITU-T standard compliant VDSL Vectoring and Pair Bonding chip enables carriers to deliver up to 150 Mbits and 200 Mbits performance, respectively, while PHY Layer Retransmission achieves highest possible media content Quality of Service (QoS).
  • High-performance dual-core CPU combined with Packet Hardware Acceleration architecture achieves industry leading CoreMark™ score, with integrated VoIP engine, Gigabit Ethernet switch and Energy Efficient Gigabit Ethernet Phy’s.
  • The embedded carrier-grade 802.11n Wi-Fi subsystem with offloading capability allows minimum load on the main CPU while Lantiq’s powerful and unique Beamforming technology provides longest reach for entire home Wi-Fi coverage independent of the Wi-Fi client used.
Market Information (IHS iSuppli) VDSL-ready CPE system shipments are forecast by IHS iSuppli to grow from about 22 million in 2012 to more than 57 million in 2016. Based on its currently shipping VRX200 family, Lantiq’s market share has increased in double digit percentages in each of the last two years. With launch of the VRX300, the company now offers two different chipset solutions to meet the cost and functionality requirements of equipment providers. Comments Dirk Wieberneit, Lantiq Senior Vice President and General Manager of the Customer Premises Equipment (CPE) Business Unit:
“Maximum bandwidth over existing copper infrastructure is a mainstay of service carrier’s network strategies through the mid-term future. We significantly increase the performance in future networks by adding our VRX300 VDSL solution to our already proven AnyWAN™ concept. Lantiq delivers valued system solutions with unique innovations to help our customers to maximize their success. Implementing Lantiq solutions enables customers optimizing development costs and shortening their time-to-market by offering a single base design approach and our Universal Gateway (UGW) Software architecture.” Availability Samples of the XWAY™ VRX300 chipset are available now. Production ramp is scheduled for June 2013. More information on the VRX300 Family, a white paper and Video Testimonials are available on our Website. About Lantiq
Lantiq offers a broad and innovative semiconductor product portfolio for next-generation networks and the digital home. Information about Lantiq is available on our Website or via Twitter @Lantiq ]]> Business & Financial Press Tue, 14 May 2013 10:15:00 +0200 Invitation to Lantiq Online Press Briefing for New VDSL Chipset http://www.lantiq.com/media-center/news/press/274-vdsl-bonding-vectoring-dls-broadband/ Ultra-Fast VDSL2 – Access Networks up to 200 Mbps Lantiq will launch the industry’s most integrated and highest performance VDSL chipset family, enabling gateway designs with data rates of up to 200 Mbps – 4X faster than a typical VDSL port offers today. To provide details on this groundbreaking news, we cordially invite you to learn more about this innovative new chipset family, which supports vectoring and bonding technologies to tune VDSL2 for highest bandwidth and features on-premise performance optimization. Dirk Wieberneit, Lantiq Senior Vice President and General Manager of the Customer Premises Equipment (CPE) Business Unit and Frank Engel, Lantiq Senior Marketing Manager for VDSL (CPE) will present the chipset details in this online press briefing. Furthermore, Lee Ratliff, Senior Analyst at IHS iSuppli will provide an overview of the VDSL market environment. Two Online Press Briefings are scheduled to make it convenient for worldwide participation:
  • Monday, May 13th, 6:00 pm to 7:00 pm Central European Summer Time (CEST) Check your local time here
  • Tuesday, May 14th, 9:00 am to 10:00 am Central European Summer Time (CEST)Check your local time here
After short presentations (maximum 30 minutes) there will be time to answer your questions. We are looking forward to your attendance at our VDSL2 High-Speed Press Web Briefing. To confirm you will join us, please register via our Online Feedback Form After your registration we will provide you with the WebEx meeting access information. More information available here.  Best Regards,

Christoph von Schierstädt
Media Relations & Internal Communications Lantiq Deutschland
phone: +49 (89) 89899 - 7556
mobile: +49 (160) 96901486
e-mail: schierstaedt@lantiq.com            ]]> Business & Financial Press Tue, 07 May 2013 11:00:00 +0200 Lantiq Announces Launch of New Website http://www.lantiq.com/media-center/news/press/lantiq-broadband-website-relaunch/ Lantiq.com has been Updated and Tailored to Provide Customers with Highly Improved Usability and One-Click Navigation Structure Munich/Neubiberg, Germany – March 28th, 2013 – Lantiq, a leading supplier of broadband access and home networking technologies, today announced that the company has re-launched its website with improved levels of content for customers. The fresh and new design of the site fully reflects the key Lantiq brand concept. The new website is engaging and simple to navigate and includes unique features and design elements: Enhanced Product and Application Section: The new underlying infrastructure makes the site far faster and more reliable. The website prominently features Lantiq’s key products for ADSL and VDSL Broadband ICs and SoCs, its Network Processor families, the company’s broadband Channel Bonding and DSL Vectoring solutions, its field proven and mature AnyWAN™ technology and Lantiq’s Wi-Fi solutions for Gateways. One-click Navigation: More user friendly navigation, with useful content just one click away and fastest access via smart drop down menus. Improved Customer Satisfaction and Support: Technical details, improved and interactive block- and application diagrams and chip design specs are prominently and easily accessible on the new page. Customers do always have a one-click access to the Lantiq Customer Data Center (Competence Center) from any page on the site. Dedicated Section for Carrier and Network Service Provider: The Website is divided into three core areas: Access Networks, Digital Home and Service Provider Needs. The Service Provider Needs section includes dedicated news and content for our customers; operators like e.g. Verizon, Deutsche Telekom or China Telecom get individual content and support for their respective needs in the Broadband Gateway and Central Office markets. Lantiq Branding Concept Consequently Implemented: The fresh and new design of the site fully reflects the key Lantiq brand concept which helps to improve user experience on the website, all routed via the dynamic and interactive entry/landing page. About Lantiq Information about Lantiq is available on our Website at: www.lantiq.com/company or via Twitter @Lantiq
                                                               ### ]]> Business & Financial Press Thu, 28 Mar 2013 11:24:00 +0100 Market Research Opinion on Lantiq GPON SFP http://www.lantiq.com/media-center/news/press/271-lantiq-gpon-sfp-market-lowest-energy/ Lantiq’s SFP-based GPON ONU positioned to catch a wave of new PON applications

OVUM VIEW

Summary

Lantiq announced availability of its GPON ONU system-on-chip (SoC) for an SFP (small form-factor pluggable) module. While SFP-based PON ONUs/ONTs are not new, Lantiq claims that its highly integrated solution lowers cost while meeting tough energy consumption requirements. Read the full story on the Ovum Website at: http://ovum.com/2013/02/21/lantiqs-sfp-based-gpon-onu-positioned-to-catch-a-wave-of-new-pon-applications/ Also visit our Announcement on GPON SFP, read our Whitepaper, listen to the press conference, etc. at our GPON Landingpage at: http://www.lantiq.com/gpon ]]> Industry News & Articles Mon, 04 Mar 2013 13:45:00 +0100 Netgear's New Mobile voice Gateway enables mobile operators to deliver high-performance4G LTE-Fixed-Line-Replacement-Services http://www.lantiq.com/media-center/news/press/270-netgear-lte-volte-wifi-lantiq-network-processor/ The MVBR1517 combines super-fast 4G LTE data, Voice over LTE and WiFi capabilities, giving end-users all-in-one access from anywhere Lantiq is proud to be a technology partner for Netgear. Today, Netgear announced it's new LTE Gateway and we are providing the Network Processor: SAN JOSE — February 19, 2013 — NETGEAR®, Inc. (NASDAQGM: NTGR) (www.netgear.com), a global networking company that delivers innovative products to consumers, businesses and service providers, today announced that it will launch the MVBR1517 4G LTE Mobile Broadband Voice Gateway at the Mobile World Congress trade show in Barcelona, Spain. NETGEAR will demonstrate its solutions for mobile operators February 25-28 in Hall 5, Stand 5102. The Full Release is available at the Netgear website. ]]> Industry News & Articles Thu, 21 Feb 2013 11:44:00 +0100 Lantiq and Market Research Company OVUM Give Briefing on GPON Market http://www.lantiq.com/media-center/news/press/269-lantiq-ovum-gpon-sfp-pon-vectoring-dsl-fiber/ Munich/Neubiberg, Germany – February 21, 2013 – Lantiq, a leading supplier of broadband access and home networking technologies, and Market Research Company OVUM will host a media briefing today on the overall GPON Market and Lantiq’s opportunities on SFP PON Applications. OVUM Principal Analyst for Components Telecoms, Julie Kunstler, and Markus Terschluse, networking expert at Lantiq and Senior Director and Head of System Technology PON will host two short press briefings in the morning and evening.
The Online Press Briefing takes place today, Thursday, February 21st, 2013.
To make it convenient for all editors we provide two time slots: 9:00 am to 10:00 am Central European Time 
(Click here to check your local time for this slot)
6:00 pm to 7:00 pm Central European Time
(Click here to check your local time for this slot) After the short presentation there will be enough time to answer questions. To register please visit: http://www.mexperts.de/lantiq-21-02-13/.  Lantiq introduced the industry-wide lowest power GPON SoC solution for SFP optical module form factor. With this announcement the company underlines its position on the forefront of the next PON (Passive Optical Networks) generation providing innovative chip solutions for the emerging GPON market.  About Lantiq
Lantiq offers a broad and innovative semiconductor product portfolio for next-generation networks and the digital home. Information about Lantiq is available on our Website  or via Twitter @Lantiq # # # ]]> Business & Financial Press Thu, 21 Feb 2013 07:45:00 +0100 Chip innovations drive deployment of GPON infrastructure http://www.lantiq.com/media-center/news/press/268-gpon-sfp-lantiq-pon-vectoring-fiber-wifi/ Lantiq Whitepaper: High integration enables cost and energy efficient solutions Gigabit Passive Optical Network (GPON) technology is the key emerging  access technology in FTTB and FTTH applications, as it provides a scalable and cost-effective architecture to satisfy the growing bandwidth requirements generated by advanced applications such as high-definition television (HDTV) or cloud computing. Leading network operators world-wide have chosen GPON as their PON technology of choice. To accelerate deployment and make
GPON attractive for end users cost optimization, energy efficiency, diversity and scalability, network stability and interoperability are seen as key requirements. Highly innovative GPON System on Chip (SoC) solutions like the FALC™ ON family from Lantiq are addressing these requirements and pave the way for network operators to deploy cost effective, space saving, energy efficient and future proven GPON networks. Read the full whitepaper here.  ]]> Industry News & Articles Wed, 20 Feb 2013 16:51:00 +0100 UMC Receives 2012 Best Supplier Award from Lantiq http://www.lantiq.com/media-center/news/press/267-umc-lantiq-best-supplier-gpon-vectoring-wifi-bonding-dslte-volte/ Hsinchu, Taiwan, February 20, 2013 -- United Microelectronics Corporation (NYSE: UMC; TSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced that it has received the "Best Supplier Award" from Lantiq for 2012. Lantiq presents this award annually to one selected supplier for their contributions to the company's success. The award was presented to CEO of UMC Mr. Po Wen Yen during a visit to Lantiq's headquarters in Neubiberg, Germany. "We are honored to receive this award from Lantiq recognizing UMC's contributions to help them deliver maximum value through world-class technology, manufacturing and service," said UMC CEO Mr. Yen. "This award highlights the strength of the partnership between UMC and Lantiq that spans multiple products and process technologies. We look forward to further enhancing our service to them in the future." Dominik Bilo, COO of Lantiq, said, "UMC is an extremely valuable partner for our fabless strategy and is producing a large portion of our wafer demand. Their high-tech expertise and mature processes are very important to secure the basis for flawless products. I anticipate a continued fruitful relationship with them as we continue to pursue new collaborative activities." About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com. More Information is available at: http://www.umc.com/English/news/2013/20130220.asp UMC
UMC Corporate Communications
Richard Yu
+886-2-2658-9168 ext. 16951
richard_yu@umc.com ]]> Industry News & Articles Wed, 20 Feb 2013 10:48:00 +0100