XWAY™ VRX300 Family – Ultra-Fast Access Network Speeds With 200 Mbps Bonding and up to 150 Mbps Vectoring Paired With Industry-Leading Integration and Flexibility for In-home Networking

VDSL2-ready CPE system shipments are forecast by IHS iSuppli to grow from about 22 million in 2012 to more than 57 million in 2016.

While market Researchers predict strong growth rates for VDSL, Lantiq already today delivers leading edge VDSL2 systems. The Lantiq VRX300 Chip Set Family drives down system costs while improving access and in-home network performance. With the VRX300 Chipset, we are again raising the bar to help equipment providers meet ever tougher requirements and reinforce the competitive position of carriers.

VRX300 Key Differentiators:

  • VDSL2 Gateway SoC providing 200 Mbps bonding throughput and up to 150 Mbps on Vectoring
  • Supporting all profiles 8, 12, 17 and 30MHz with one single PCB design
  • Part of Lantiq AnyWAN™ technology allows maximum Software reuse and short time to market
  • Embedded WiFi 11n subsystem with offloading architecture allows minimum load on the main CPU
  • Lantiq’s unique Beamforming technology allows longest reach



  • VRX300 Chip Set is sampling now
    Volume production end June 2013

Diagram - XWAY™ VRX300 Chipset Family - Two Pair Bonded

XWAY™ VRX300 Chipset Family

Diagram - XWAY™ VRX300 Chipset Family - Single-Pair

XWAY™ VRX300 Chipset Family


The Lantiq XWAY™ VRX300 is the industry’s most integrated and highest performance VDSL chipset
Dirk Wieberneit, Lantiq Senior Vice President and General Manager of the Customer Premises Equipment (CPE) Business Unit
Frank Engel, Lantiq Senior Marketing Manager for VDSL (CPE)
Lee Ratliff, Senior Analyst at IHS iSuppli

Media Relations Contact

Lantiq Media Relations Europe
Christoph von Schierstädt
phone: +49 89 89899 7556
mobile: +49 160 96901486

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